IP Library › Assignment 028855/0989
Patent Assignment
Reel/Frame 028855/0989

Assignment of Assignor's Interest

Recorded: 2012-08-27 Pages: 4
Assignors
LOH, ALBERT
Executed: 2012-08-15
THEN, EDWARD
Executed: 2012-08-21
PEDRON, SERAFIN, JR.
Executed: 2012-08-15
SIRINORAKUL, SARAVUTH
Executed: 2012-08-15
Assignee
UTAC DONGGUAN LTD.
ZHEN AN HI-TECH INDUSTRIAL PARK, CHANG AN TOWN, DONGGUAN CITY, 523850, CHINA
Covered Property (1)
Thermal Leadless Array Package with Die Attach Pad Locking Feature
Patent: 9,196,504 →
Application: 13/541,561 →
Publication: US 2014/0008777
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2016
From: UTAC DONGGUAN LTD
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037791/0969 →
Corrective Assignment to Add the Annex a Which Was Inadvertently Left Out in the Original Assignment Document Previously Recorded on Reel 037791 Frame 0969. Assignor(S) Hereby Confirms the Assignment. Jun 15, 2016
From: UTAC DONGGUAN LTD
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039022/0944 →