Patent Assignment
Reel/Frame 037791/0969
Assignment of Assignor's Interest
Recorded: 2016-02-23
Pages: 4
Assignor
UTAC DONGGUAN LTD
Executed: 2015-05-08
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Thermal Leadless Array Package with Die Attach Pad Locking Feature
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2012
From: LOH, ALBERT; THEN, EDWARD; PEDRON, SERAFIN, JR.; SIRINORAKUL, SARAVUTH
To: UTAC DONGGUAN LTD.
Reel/Frame 028855/0989 →
Corrective Assignment to Add the Annex a Which Was Inadvertently Left Out in the Original Assignment Document Previously Recorded on Reel 037791 Frame 0969. Assignor(S) Hereby Confirms the Assignment.
Jun 15, 2016
From: UTAC DONGGUAN LTD
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039022/0944 →