Corrective Assignment to Add the Annex a Which Was Inadvertently Left Out in the Original Assignment Document Previously Recorded on Reel 037791 Frame 0969. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-06-15 Pages: 8

Assignor

UTAC DONGGUAN LTD

Executed: 2015-05-08

Assignee

UTAC HEADQUARTERS PTE. LTD.

22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE

Covered Property (1)

Thermal Leadless Array Package with Die Attach Pad Locking Feature

Patent: 9,196,504 →

Application: 13/541,561 →

Publication: US 2014/0008777

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.