IP Library Assignment 028944/0790
Patent Assignment
Reel/Frame 028944/0790

Assignment of Assignor's Interest

Recorded: 2012-09-12 Pages: 2
Assignor
SU, QING
Executed: 2012-09-04
Assignee
SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
1188 CHUANQIAO ROAD, PUDONG NEW AREA, SHANGHAI, 201206, CHINA
Covered Property (1)
Bond Pad Structure
Patent: 8,878,370 →
Application: 13/611,441 →
Publication: US 2013/0075931
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 13, 2014
From: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
To: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 032885/0047 →