IP Library › Assignment 028949/0340
Patent Assignment
Reel/Frame 028949/0340

Assignment of Assignor's Interest

Recorded: 2012-09-12 Pages: 3
Assignors
DANG, BING
Executed: 2012-09-11
GAYNES, MICHAEL A.
Executed: 2012-09-11
LAURO, PAUL A.
Executed: 2012-09-07
NAH, JAE-WOONG
Executed: 2012-09-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Direct Injection Molded Solder Process for Forming Solder Bumps on Wafers
Patent: 9,273,408 →
Application: 13/612,812 →
Publication: US 2014/0069817
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Jul 2, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0749 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →