Patent Assignment
Reel/Frame 029151/0902
Assignment of Assignor's Interest
Recorded: 2012-10-18
Pages: 8
Assignors
ESPIRITU, EMMANUEL
Executed: 2011-10-28
BATHAN, HENRY DESCALZO
Executed: 2011-10-28
CAMACHO, ZIGMUND RAMIREZ
Executed: 2011-11-08
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with Lead Frame and Method of Manufacture Thereof
Integrated Circuit Packaging System with Lead Frame and Method of Manufacture Thereof
Application:
61/407,881 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0161 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →
Corrective Assignment to Correct the Spelling of the Assignee's Name on the Cover Sheet Previously Recorded at Reel: 038378 Frame: 0161. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064805/0735 →