Patent Assignment
Reel/Frame 029238/0279
Security Agreement
Recorded: 2012-11-05
Pages: 10
Assignor
RJR POLYMERS, INC.
Executed: 2012-10-18
Assignee
SILICON VALLEY BANK
380 INTERLOCKEN CRESCENT, SUITE 600, BROOMFIELD, COLORADO, 80021
Covered Properties
(11)
Iso-Thermal Seal Process for Electronic Devices
Patent:
5,056,296 →
Application:
07/502,558 →
Integrated Circuit Packages with Heat Dissipation for High Current Load
Patent:
5,572,070 →
Application:
08/383,511 →
Method of Assembling Intergrated Circuit Package
Patent:
5,706,579 →
Application:
08/631,649 →
Inverted Stamping Process
Patent:
5,816,158 →
Application:
08/952,336 →
Lead Frame Moisture Barrier for Molded Plastic Electronic Packages
Patent:
6,214,152 →
Application:
09/273,608 →
Use of Diverse Materials in Air-Cavity Packaging of Electronic Devices
Modular Low Stress Package Technology
Modular Low Stress Package Technology
Modular Low Stress Package Technology
Modular Low Stress Package Technology
Modular Low Stress Package Technology
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
May 17, 1990
From: ROSS, RICHARD J.; CAMPBELL, JERRY E.
To: RJR POLYMERS, INC.
Reel/Frame 005309/0920 →
Assignment of Assignor's Interest
Mar 13, 1995
From: ROSS, RICHARD J.
To: RJR POLYMERS, INC.
Reel/Frame 007374/0602 →
Assignment of Assignor's Interest
Feb 2, 1998
From: ROSS, RICHARD J.
To: RJR POLYMERS, INC.
Reel/Frame 008953/0695 →
Assignment of Assignor's Interest
Mar 22, 1999
From: ROSS, RICHARD J.; ROSS, CYNTHIA L.; SHAFFER, TONY B.; NI, JOHN QIANG
To: RJR POLYMERS, INC.
Reel/Frame 009868/0961 →
Assignment of Assignor's Interest
Nov 28, 2001
From: BREGANTE, RAYMOND S.; SHAFFER, TONY; MELLEN, K. SCOTT; ROSS, RICHARD J.
To: RJR POLYMERS, INC.
Reel/Frame 012465/0350 →
Assignment of Assignor's Interest
Oct 14, 2010
From: ROTAY, CRAIG J.
To: STMICROELECTRONICS, INC.
Reel/Frame 025138/0634 →
Assignment of Assignor's Interest
Oct 14, 2010
From: NI, JOHN; LAM, DAVID; DEWIRE, DAVID LEE; ROMAN, JOHN W
To: RJR POLYMERS, INC.
Reel/Frame 025138/0640 →
Assignment of Assignor's Interest
Oct 14, 2010
From: NI, JOHN; LAM, DAVID; DEWIRE, DAVID LEE; ROMAN, JOHN W
To: RJR POLYMERS, INC.
Reel/Frame 025138/0076 →
Assignment of Assignor's Interest
Oct 14, 2010
From: NI, JOHN; LAM, DAVID; DEWIRE, DAVID LEE; ROMAN, JOHN W
To: RJR POLYMERS, INC.
Reel/Frame 025149/0136 →
Assignment of Assignor's Interest
Oct 14, 2010
From: ROTAY, CRAIG J.
To: STMICROELECTRONICS, INC.
Reel/Frame 025138/0120 →
Assignment of Assignor's Interest
Oct 14, 2010
From: ROTAY, CRAIG J.
To: STMICROELECTRONICS, INC.
Reel/Frame 025138/0364 →
Assignment of Assignor's Interest
Oct 14, 2010
From: NI, JOHN; LAM, DAVID; DEWIRE, DAVID LEE; ROMAN, JOHN W
To: RJR POLYMERS, INC.
Reel/Frame 025138/0477 →
Assignment of Assignor's Interest
Oct 14, 2010
From: ROTAY, CRAIG J.
To: STMICROELECTRONICS, INC.
Reel/Frame 025138/0548 →
Assignment of Assignor's Interest
Dec 9, 2010
From: ROTAY, CRAIG J.
To: STMICROELECTRONICS, INC.
Reel/Frame 025730/0154 →
Assignment of Assignor's Interest
Dec 9, 2010
From: NI, JOHN; LAM, DAVID; DEWIRE, DAVID LEE; ROMAN, JOHN W.
To: RJR POLYMERS, INC.
Reel/Frame 025641/0576 →