Patent Assignment
Reel/Frame 029311/0047
Assignment of Assignor's Interest
Recorded: 2012-11-16
Pages: 9
Assignors
KELLY, MICHAEL G.
Executed: 2012-11-08
HUEMOELLER, RONALD PATRICK
Executed: 2012-11-07
HINER, DAVID JON
Executed: 2012-11-07
DO, WON CHUL
Executed: 2012-11-14
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Method and System for a Semiconductor for Device Package with a Die-to-Packaging Substrate First Bond
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →