Patent Assignment
Reel/Frame 029389/0403
Assignment of Assignor's Interest
Recorded: 2012-12-01
Pages: 3
Assignors
LAMPRECHT, SVEN
Executed: 2012-11-28
MATEJAT, KAI-JENS
Executed: 2012-11-28
EWERT, INGO
Executed: 2012-11-29
KENNY, STEPHEN
Executed: 2012-11-28
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method to Form Solder Deposits on Substrates
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →