Patent Assignment
Reel/Frame 029527/0538
Assignment of Assignor's Interest
Recorded: 2012-12-26
Pages: 4
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming via Hole in Circuit Board
Application:
13/727,038 →
Publication:
US 2013/0168349
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.