Patent Assignment
Reel/Frame 029588/0290
Assignment of Assignor's Interest
Recorded: 2013-01-08
Pages: 4
Assignees
MITSUI ENGINEERING & SHIPBUILDING CO., LTD
6-4, TSUKIJI 5-CHOME, CHUO-KU, TOKYO, 104-8439, JAPAN
ADMAP INC
16-2, TAMAHARA 3-CHOME, TAMANO-SHI, OKAYAMA, 706-0014, JAPAN
Covered Property
(1)
Silicon Carbide Substrate, Semiconductor Device, and Soi Wafer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 9, 2018
From: MITSUI ENGINEERING & SHIPBUILDING CO., LTD.
To: MITSUI E&S MACHINERY CO., LTD.
Reel/Frame 046755/0011 →
Assignment of Assignor's Interest
Aug 29, 2019
From: ADMAP, INC.
To: MITSUI E&S MACHINERY CO., LTD.
Reel/Frame 050215/0333 →
Assignment of Assignor's Interest
Sep 13, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050370/0773 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 050370 Frame: 0773. Assignor(S) Hereby Confirms the Assignment.
Sep 19, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050441/0158 →
Assignment of Assignor's Interest
Apr 17, 2023
From: FERROTEC HOLDINGS CORPORATION
To: FERROTEC MATERIAL TECHNOLOGIES CORPORATION
Reel/Frame 063343/0210 →