Patent Assignment
Reel/Frame 050215/0333
Assignment of Assignor's Interest
Recorded: 2019-08-29
Pages: 2
Assignor
ADMAP, INC.
Executed: 2019-08-26
Assignee
MITSUI E&S MACHINERY CO., LTD.
6-4, TSUKIJI 5-CHOME, CHUO-KU, TOKYO, 104-8439, JAPAN
Covered Properties
(2)
Method for Production of Substrate Electrode for Plasma Processing
Silicon Carbide Substrate, Semiconductor Device, and Soi Wafer
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 10, 2009
From: KAWAHAWA, FUMITOMO
To: MITSUI ENGINEERING & SHIPBUILDING CO., LTD.; ADMAP INC
Reel/Frame 023734/0200 →
Assignment of Assignor's Interest
Jan 8, 2013
From: KAWAMOTO, SATOSHI; NAKAMURA, MASAKI
To: MITSUI ENGINEERING & SHIPBUILDING CO., LTD; ADMAP INC
Reel/Frame 029588/0290 →
Change of Name
Aug 9, 2018
From: MITSUI ENGINEERING & SHIPBUILDING CO., LTD.
To: MITSUI E&S MACHINERY CO., LTD.
Reel/Frame 046755/0011 →
Assignment of Assignor's Interest
Sep 13, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050370/0773 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 050370 Frame: 0773. Assignor(S) Hereby Confirms the Assignment.
Sep 19, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050441/0158 →
Assignment of Assignor's Interest
Apr 17, 2023
From: FERROTEC HOLDINGS CORPORATION
To: FERROTEC MATERIAL TECHNOLOGIES CORPORATION
Reel/Frame 063343/0210 →