Patent Assignment
Reel/Frame 029663/0910
Assignment of Assignor's Interest
Recorded: 2013-01-21
Pages: 5
Assignors
MCELREA, SIMON J.S.
Executed: 2008-07-08
ANDREWS, LAWRENCE DOUGLAS, JR.
Executed: 2008-07-07
MCGRATH, SCOTT
Executed: 2008-07-07
CASKEY, TERRENCE
Executed: 2008-07-07
CRANE, SCOTT JAY
Executed: 2008-07-14
ROBINSON, MARC E.
Executed: 2008-06-09
CANTILLEP, LORETO
Executed: 2008-07-07
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Electrically Interconnected Stacked Die Assemblies
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →