Patent Assignment
Reel/Frame 029741/0717
Assignment of Assignor's Interest
Recorded: 2013-02-01
Pages: 8
Assignors
ZHANG, XUNYUAN
Executed: 2013-01-28
ZHAO, LARRY
Executed: 2013-01-28
HE, MING
Executed: 2013-01-30
LIN, SEAN
Executed: 2013-01-28
IACOPONI, JOHN
Executed: 2013-01-29
RYAN, ERROL TODD
Executed: 2013-01-28
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Methods of Forming Conductive Copper-Based Structures Using a Copper-Based Nitride Seed Layer Without a Barrier Layer and the Resulting Device
Patent:
8,753,975 →
Application:
13/757,288 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 12, 2018
From: RYAN, ERROL TODD
To: GLOBALFOUNDRIES INC.
Reel/Frame 047477/0778 →
Assignment of Assignor's Interest
Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →