Patent Assignment
Reel/Frame 029843/0473
Assignment of Assignor's Interest
Recorded: 2013-02-20
Pages: 4
Assignors
WANG, YUN
Executed: 2013-01-22
CHIANG, TONY
Executed: 2013-01-23
MINVIELLE, TIM
Executed: 2013-01-17
YAMAGUCHI, TAKESHI
Executed: 2013-01-17
Assignees
INTERMOLECULAR, INC.
3011 N. FIRST STREET, SAN JOSE, CALIFORNIA, 95134
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
SANDISK 3D LLC
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95034
Covered Property
(1)
Resistive Random Access Memory Access Cells Having Thermally Isolating Structures
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 040381/0032 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →