Patent Assignment
Reel/Frame 029927/0370
Assignment of Assignor's Interest
Recorded: 2013-02-12
Pages: 4
Assignors
KATOU, RIE
Executed: 2013-01-21
MATSUZAKI, TAKAYUKI
Executed: 2013-01-18
KATOU, SHINYA
Executed: 2013-01-21
FURUTANI, RYOJI
Executed: 2013-01-23
SAKUTA, TATSUYA
Executed: 2013-01-23
KOMORIDA, KOUJI
Executed: 2013-01-21
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Dicing/Die Bonding Integral Film, Dicing/Die Bonding Integral Film Manufacturing Method, and Semiconductor Chip Manufacturing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Change of Address of Assignee
Jan 26, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 034816/0673 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →