Patent Assignment
Reel/Frame 034816/0673
Notice of Change of Address of Assignee
Recorded: 2015-01-26
Pages: 3
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Dicing/Die Bonding Integral Film, Dicing/Die Bonding Integral Film Manufacturing Method, and Semiconductor Chip Manufacturing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 12, 2013
From: KATOU, RIE; MATSUZAKI, TAKAYUKI; KATOU, SHINYA; FURUTANI, RYOJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 029927/0370 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →