IP Library › Assignment 029928/0223
Patent Assignment
Reel/Frame 029928/0223

Assignment of Assignor's Interest

Recorded: 2013-03-05 Pages: 8
Assignors
LIN, SEAN X.
Executed: 2013-02-22
ZHANG, XUNYUAN
Executed: 2013-02-25
HE, MING
Executed: 2013-02-26
ZHAO, LARRY
Executed: 2013-02-26
IACOPONI, JOHN
Executed: 2013-02-26
TANWAR, KUNALJEET
Executed: 2013-02-20
Assignee
GLOBALFOUNDRIES INC.
PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Electroless Fill of Trench in Semiconductor Structure
Patent: 9,087,881 →
Application: 13/785,934 →
Publication: US 2014/0252616
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →