Patent Assignment
Reel/Frame 030012/0198
Assignment of Assignor's Interest
Recorded: 2013-03-15
Pages: 2
Assignor
KIM, SUNGHYOK
Executed: 2013-03-13
Assignee
DONGBU HITEK CO., LTD.
90, SUDO-RO, WONMI-GU, BUCHEON-SI, GYEONGGI-DO, 420-712, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Forming Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD.
Reel/Frame 044559/0819 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest
Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →