Patent Assignment
Reel/Frame 030249/0522
Correction to Address
Recorded: 2013-04-19
Pages: 3
Assignor
ELPIDA MEMORY, INC.
Executed: 2013-04-05
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Module in Which a Semiconductor Package Is Bonded on a Mount Substrate
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 1, 2004
From: TANIE, HISASHI; HISANO, NAE; HOSOKAWA, KOJI
To: HITACHI, LTD.; ELPIDA MEMORY, INC.
Reel/Frame 015752/0090 →
Assignment of Assignor's Interest
Apr 19, 2013
From: HITACHI, LTD.; ELPIDA MEMORY, INC.
To: ELPIDA MEMORY, INC.
Reel/Frame 030248/0979 →
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest
Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046867/0248 →