Semiconductor module in which a semiconductor package is bonded on a mount substrate
View Patent ↗A semiconductor module comprises: semiconductor packages each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a first organic film formed on a side of the semiconductor element opposed to a side toward the wiring substrate; and a mount substrate, on which the semiconductor element is mounted. First of the semiconductor packages and second of the semiconductor packages are stacked. Second organic films are provided between the wiring substrate of the first semiconductor package and the first organic film of the second semiconductor package and between the mount substrate and the semiconductor package.
1. A semiconductor module comprising:
a first semiconductor package and a second semiconductor package each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a back-surface member formed on a side of the semiconductor element opposed to another side of the semiconductor element toward the wiring substrate; and
a mount substrate, on which the first semiconductor package is mounted;
wherein the second semiconductor package is stacked on the first semiconductor package,
wherein a first bonding layer is provided between the wiring substrate of the first semiconductor package and the back-surface member of the second semiconductor package, and
wherein each back-surface member is formed of a material selected based upon a coefficient of linear expansion and a modulus of longitudinal elasticity of the material in order to minimize bending deformation and warp of the semiconductor elements,
wherein a second bonding layer is provided between the back-surface member of the first semiconductor substrate and the mount substrate, and
wherein each back-surface member is arranged on at least portions including corners of the back surface of an associated semiconductor element.
2. A semiconductor module comprising:
a first semiconductor package comprising a semiconductor element, a wiring substrate having a wiring member connected to a semiconductor element and external terminals connected to the wiring member, and a back-surface member formed on a side of the semiconductor element opposed to another side of the semiconductor element toward the wiring substrate; and
a mount substrate, on which the first semiconductor package is mounted;
wherein a bonding layer is provided between the back-surface member of the first semiconductor package and the mount substrate,
wherein the back-surface member is formed of a material selected based upon a coefficient of linear expansion and a modulus of longitudinal elasticity of the material in order to minimize bending deformation and warp of the semiconductor element, and
wherein the back-surface member is arranged on at least portions including corners of the back surface of the semiconductor element.
3. A semiconductor module according to claim 1 or 2 , wherein the semiconductor element of the first semiconductor package is mounted on the wiring substrate of the first semiconductor package on the same side as that, on which a connection member to be connected to the external terminals is mounted.
4. A semiconductor module according to claim 1 or 2 , wherein the wiring substrate comprises two wiring layers on both sides thereof.
5. A semiconductor module according to claim 1 or 2 , wherein the bonding layer comprises an epoxy resin.
6. A semiconductor module according to claim 1 , wherein the external terminals are connected to a solder member, and the solder member connecting between the first semiconductor package and the second semiconductor package has a larger length than a thickness of the semiconductor element.