IP Library › Assignment 030310/0328
Patent Assignment
Reel/Frame 030310/0328

Assignment of Assignor's Interest

Recorded: 2013-04-29 Pages: 8
Assignors
AHN, HEUI-GYUN
Executed: 2013-02-27
JEON, IN-GYUN
Executed: 2013-02-27
WON, JUN-HO
Executed: 2013-02-27
Assignee
SILICONFILE TECHNOLOGIES INC.
19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Pad in Wafer with Three-Dimensional Stacking Structure
Patent: 8,993,411 →
Application: 13/775,178 →
Publication: US 2013/0189828
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 9, 2015
From: OH, SE-JUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 035367/0811 →
Assignment of Assignor's Interest Jan 20, 2017
From: SILICONFILE TECHNOLOGIES INC.
To: SK HYNIX INC.
Reel/Frame 041023/0058 →