Patent Assignment
Reel/Frame 035367/0811
Assignment of Assignor's Interest
Recorded: 2015-04-09
Pages: 4
Assignor
OH, SE-JUNG
Executed: 2015-04-07
Assignee
SILICONFILE TECHNOLOGIES INC.
19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Pad in Wafer with Three-Dimensional Stacking Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.