Patent Assignment
Reel/Frame 030512/0612
Assignment of Assignor's Interest
Recorded: 2013-05-30
Pages: 6
Assignors
HSUEH, CHIEN-LAN
Executed: 2013-01-30
HIGUCHI, RANDALL
Executed: 2013-01-30
MINVIELLE, TIM
Executed: 2013-01-17
TONG, JINHONG
Executed: 2013-05-29
WANG, YUN
Executed: 2013-01-22
YAMAGUCHI, TAKESHI
Executed: 2013-01-17
Assignees
INTERMOLECULAR, INC.
3011 N. FIRST STREET, SAN JOSE, CALIFORNIA, 95134
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
SANDISK 3D LLC
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95034
Covered Property
(1)
Resistive Switching Layers Including Hf-Al-O
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 040381/0032 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →