Patent Assignment
Reel/Frame 030614/0814
Assignment of Assignor's Interest
Recorded: 2013-06-14
Pages: 6
Assignors
LIN, YAOJIAN
Executed: 2013-06-13
CHEN, KANG
Executed: 2013-06-13
GU, YU
Executed: 2013-06-13
MARIMUTHU, PANDI CHELVAM
Executed: 2013-06-13
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0391 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052963/0546 →
Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. Lte. " to Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038378 Frame: 0391. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064809/0877 →