IP Library › Assignment 030977/0302
Patent Assignment
Reel/Frame 030977/0302

Assignment of Assignor's Interest

Recorded: 2013-08-09 Pages: 4
Assignors
HASHINO, EIJI
Executed: 2013-07-26
ISHIKAWA, SHINJI
Executed: 2013-07-26
TERASHIMA, SHINICHI
Executed: 2013-07-26
TANAKA, MASAMOTO
Executed: 2013-07-26
Assignee
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Property (1)
Lead-Free Solder Bump Bonding Structure
Patent: 8,847,390 →
Application: 13/951,596 →
Publication: US 2014/0054766
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 6, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051213/0593 →