IP Library › Assignment 051213/0593
Patent Assignment
Reel/Frame 051213/0593

Change of Name

Recorded: 2019-12-06 Pages: 22
Assignor
Assignee
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
16-3,GINZA 7-CHOME, CHUO-KU,, TOKYO, JAPAN
Covered Property (1)
Lead-Free Solder Bump Bonding Structure
Patent: 8,847,390 →
Application: 13/951,596 →
Publication: US 2014/0054766
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 9, 2013
From: HASHINO, EIJI; ISHIKAWA, SHINJI; TERASHIMA, SHINICHI; TANAKA, MASAMOTO
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 030977/0302 →