Patent Assignment
Reel/Frame 030998/0669
Assignment of Assignor's Interest
Recorded: 2013-08-13
Pages: 4
Assignors
FULLER, NICHOLAS C.M.
Executed: 2013-08-05
JOSEPH, ERIC A.
Executed: 2013-08-05
SIKORSKI, EDMUND M.
Executed: 2013-08-05
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
High Aspect Ratio and Reduced Undercut Trench Etch Process for a Semiconductor Substrate
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 13, 2013
From: MATSUURA, GOH
To: ZEON CORPORATION
Reel/Frame 030998/0687 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →