IP Library › Assignment 031075/0865
Patent Assignment
Reel/Frame 031075/0865

Assignment of Assignor's Interest

Recorded: 2013-08-22 Pages: 6
Assignors
SO, KWANG SUP
Executed: 2013-08-05
PARK, NO SUN
Executed: 2013-08-05
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property (1)
Plating Structure For Wafer Level Packages
Patent: 9,070,675 →
Application: 13/973,492 →
Publication: US 2014/0070408
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →