IP Library › Assignment 031562/0373
Patent Assignment
Reel/Frame 031562/0373

Assignment of Assignor's Interest

Recorded: 2013-11-07 Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2013-10-17
CHEN, CHEN-SHIEN
Executed: 2013-10-17
HU, YEN-CHANG
Executed: 2013-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
3D Die Stacking Structure with Fine Pitches
Patent: 9,379,078 →
Application: 14/074,186 →
Publication: US 2015/0123268
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Third Assignor's Name Previously Recorded at Reel: 031562 Frame: 0373. Assignor(S) Hereby Confirms the Assignment. Jun 5, 2019
From: YU, CHEN-HUA; CHEN, CHEN-SHIEN; HU, SHOU-CHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 049375/0029 →