Corrective Assignment to Correct the Third Assignor's Name Previously Recorded at Reel: 031562 Frame: 0373. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2019-06-05 Pages: 7

Assignors

YU, CHEN-HUA

Executed: 2019-06-03

CHEN, CHEN-SHIEN

Executed: 2019-05-31

HU, SHOU-CHENG

Executed: 2019-03-12

Assignee

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Property (1)

3D Die Stacking Structure with Fine Pitches

Patent: 9,379,078 →

Application: 14/074,186 →

Publication: US 2015/0123268

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.