IP Library Assignment 031727/0583
Patent Assignment
Reel/Frame 031727/0583

Assignment of Assignor's Interest

Recorded: 2013-12-06 Pages: 4
Assignors
ROHDE, DIRK
Executed: 2013-12-05
ROELFS, BERND
Executed: 2013-12-03
HIGUCHI, JUN
Executed: 2013-11-21
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property (1)
Method for Copper Plating
Patent: 9,506,158 →
Application: 14/124,268 →
Publication: US 2014/0102910
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Security Interest Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Release of Security Interest Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →