Patent Assignment
Reel/Frame 031843/0940
Assignment of Assignor's Interest
Recorded: 2013-12-23
Pages: 6
Assignors
MARIMUTHU, PANDI C.
Executed: 2013-12-19
LIN, YAOJIAN
Executed: 2013-12-19
CHOI, WON KYOUNG
Executed: 2013-12-19
SHIM, IL KWON
Executed: 2013-12-19
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 20, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 037096/0315 →
Release of Security Interest
Jun 18, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052972/0001 →