Patent Assignment
Reel/Frame 031872/0513
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2013-12-18
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(10)
Image Alignment Method, Comparative Inspection Method, and Comparative Inspection Device for Comparative Inspections
Method for Inspecting Defects and an Apparatus for the Same
Method and Apparatus for Inspecting a Semiconductor Device
Method of Fabricating a Semiconductor Device
Method for Manufacturing Semiconductor Devices and Method and Its Apparatus for Processing Detected Defect Data
Method for Manufacturing Semiconductor Devices and Method and Its Apparatus for Processing Detected Defect Data
Method for Inspecting Defects and an Apparatus of the Same
Image Alignment Method, Comparative Inspection Method, and Comparative Inspection Device for Comparative Inspections
Method and Apparatus for Inspecting a Semiconductor Device
Image Alignment Method, Comparative Inspection Method, and Comparative Inspection Device for Comparative Inspections
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.