Assignment of Assignor's Interest

Recorded: 2014-01-15 Pages: 5

Assignors

KIM, WOO JIN

Executed: 2014-01-08

KIM, SUN JAE

Executed: 2014-01-08

AHN, CHUNG LYUL

Executed: 2014-01-08

KANG, HYEON YI

Executed: 2014-01-15

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Pattern-Through-Mold and Method of Manufacture Thereof

Patent: 9,202,742 →

Application: 14/156,271 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.