Patent Assignment
Reel/Frame 031984/0089
Assignment of Assignor's Interest
Recorded: 2014-01-16
Pages: 6
Assignors
LIAO, CHIH-CHIN
Executed: 2010-07-28
YU, CHEEMAN
Executed: 2010-07-27
LEE, YA HUEI
Executed: 2010-07-28
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Semiconductor Device with Die Stack Arrangement Including Staggered Die and Efficient Wire Bonding
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 16, 2014
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 031984/0123 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0898 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →