IP Library › Assignment 032077/0304
Patent Assignment
Reel/Frame 032077/0304

Assignment of Assignor's Interest

Recorded: 2014-01-29 Pages: 4
Assignors
HIROTSURU, HIDEKI
Executed: 2013-12-27
TSUKAMOTO, HIDEO
Executed: 2013-12-26
ISHIHARA, YOSUKE
Executed: 2013-12-24
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI, 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property (1)
Heat Dissipating Component for Semiconductor Element
Patent: 9,524,918 →
Application: 14/235,533 →
Publication: US 2014/0182824
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 5, 2016
From: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
To: DENKA COMPANY LIMITED
Reel/Frame 040226/0051 →