IP Library › Assignment 040226/0051
Patent Assignment
Reel/Frame 040226/0051

Change of Name

Recorded: 2016-10-05 Pages: 14
Assignor
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property (1)
Heat Dissipating Component for Semiconductor Element
Patent: 9,524,918 →
Application: 14/235,533 →
Publication: US 2014/0182824
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 29, 2014
From: HIROTSURU, HIDEKI; TSUKAMOTO, HIDEO; ISHIHARA, YOSUKE
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 032077/0304 →