Assignment of Assignor's Interest

Recorded: 2014-03-31 Pages: 5

Assignors

HUBBARD, ROBERT L.

Executed: 2014-03-17

AHMAD, IFTIKHAR

Executed: 2014-03-18

Assignee

LAMBDA TECHNOLOGIES, INC.

860 AVIATION PKWY., SUITE 900, MORRISVILLE, NORTH CAROLINA, 27560

Covered Properties (5)

Method for Lower Thermal Budget Multiple Cures in Semiconductor Packaging

Patent: 9,508,616 →

Application: 13/506,722 →

Publication: US 2013/0302917

Method for lower thermal budget multiple cures in semiconductor packaging

Application: 13/506,723 →

Publication: US 2013/0299953

Method of curing thermoplastics with microwave energy

Patent: 10,224,258 →

Application: 13/986,012 →

Publication: US 2014/0284821

Method and apparatus for microwave treatment of dielectric films

Application: 61/854,556 →

Method for microwave processing of photosensitive polyimides

Application: 61/964,748 →

Related Assignments (2)

Other recorded transfers of the patents in this record — the chain of ownership.