IP Library › Assignment 035988/0641
Patent Assignment
Reel/Frame 035988/0641

Assignment of Assignor's Interest

Recorded: 2015-06-29 Pages: 9
Assignor
LAMBDA TECHNOLOGIES, INC.
Executed: 2015-04-27
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (15)
Apparatus and method for heat treatment of coatings on substrates
Patent: 9,750,091 →
Application: 13/573,947 →
Publication: US 2014/0103030
Method for Lower Thermal Budget Multiple Cures in Semiconductor Packaging
Patent: 9,508,616 →
Application: 13/506,722 →
Publication: US 2013/0302917
Process for Assembling Electronics Using Microwave Irradiation
Patent: 5,644,837 →
Application: 08/497,019 →
System and Apparatus for Reducing Arcing and Localized Heating During Microwave Processing
Patent: 5,750,968 →
Application: 08/497,603 →
Systems and Methods for Monitoring Material Properties Using Microwave Energy
Patent: 5,648,038 →
Application: 08/531,045 →
Conductive Insert for Bonding Components with Microwave Energy
Patent: 6,312,548 →
Application: 08/625,752 →
Curing Polymer Layers on Semiconductor Substrates Using Variable Frequency Microwave Energy
Patent: 5,738,915 →
Application: 08/716,043 →
Curing Polymer Layers on Semiconductor Substrates Using Variable Frequency Microwave Energy
Patent: 5,879,756 →
Application: 08/947,945 →
Microwave Curable Adhesive
Patent: 6,103,812 →
Application: 08/964,139 →
Method and Apparatus for Controlled Thermal Processing
Patent: 8,021,898 →
Application: 12/807,994 →
Publication: US 2011/0076786
Method and Apparatus for Uniform Microwave Treatment of Semiconductor Wafers
Patent: 7,939,456 →
Application: 12/924,004 →
Publication: US 2011/0076787
Method of curing thermoplastics with microwave energy
Application: 13/986,012 →
Publication: US 2014/0284821
Method and Apparatus for Controlled Broadband Microwave Heating
Application: 13/986,250 →
Publication: US 2014/0305934
Method and apparatus for microwave treatment of dielectric films
Application: 61/854,556 →
Method for lower thermal budget multiple cures in semiconductor packaging
Application: 13/506,723 →
Publication: US 2013/0299953
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 1995
From: FATHI, ZAKARAYE; GARARD, RICHARD S.; WEI, JIANGHUA
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 007585/0242 →
Assignment of Assignor's Interest Jun 30, 1995
From: FATHI, ZAKARAYE; GARARD, RICHARD S.; WEI, JIANGHUA
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 007609/0176 →
Assignment of Assignor's Interest Sep 20, 1995
From: FATHI, ZAKARYAE; GARARD, RICHARD S.; WEI, JIANGHUA; HAMPTON, MICHAEL L.
To: LAMBDA TECHNOLOGIES
Reel/Frame 007645/0094 →
Assignment of Assignor's Interest Mar 29, 1996
From: FATHI, ZAKARYAE; GARARD, RICHARD S.; WEI, JIANGHUA
To: LAMBDA TECHNOLOGIES
Reel/Frame 008047/0330 →
Assignment of Assignor's Interest Jan 14, 1997
From: FATHI, ZAKARYAE; TUCKER, DENISE A.; GARARD, RICHARD S.; WEI, JIANGHUA
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 008310/0234 →
Assignment of Assignor's Interest Apr 13, 1998
From: WEI, JIANGHUA; FATHI, ZAKARYAE
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 009120/0557 →
Assignment of Assignor's Interest Mar 14, 2011
From: AHMAD, IFTIKHAR; HICKS, KEITH R
To: LAMBDA TECHNOLOGIES, INC
Reel/Frame 025955/0825 →
Assignment of Assignor's Interest Oct 9, 2013
From: AHMAD, IFTIKHAR; DECAMILLIS, CLAYTON R.; SCHAUER, ROBERT J.; NEVILLE, JAMES E.
To: LAMBDA TECHNOLOGIES, INC.; HELLER INDUSTRIES, INC.
Reel/Frame 031440/0358 →
Assignment of Assignor's Interest Mar 31, 2014
From: HUBBARD, ROBERT L.; AHMAD, IFTIKHAR
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 032613/0828 →
Assignment of Assignor's Interest Apr 4, 2014
From: DECAMILLIS, CLAYTON R.; WANDER, JOSEPH M.; HAZELHURST, RICHARD C.; HAMPTON, MICHAEL L.
To: LAMBDA TECHNOLOGIES, INC.
Reel/Frame 032681/0681 →
Assignment of Assignor's Interest Sep 17, 2015
From: LAMBDA TECHNOLOGIES, INC.
To: APPLIED MATERIALS, INC.
Reel/Frame 036588/0943 →