Patent Assignment
Reel/Frame 032667/0872
Assignment of Assignor's Interest
Recorded: 2014-04-14
Pages: 5
Assignors
FALSTER, ROBERT J.
Executed: 2013-03-27
VORONKOV, VLADIMIR V.
Executed: 2013-03-27
ALBRECHT, PETER D.
Executed: 2013-03-13
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 1, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; PITNEY, JOHN A.; ALBRECHT, PETER D.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032798/0416 →
Assignment of Assignor's Interest
May 22, 2014
From: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 032947/0117 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →