Patent Assignment
Reel/Frame 032798/0416
Assignment of Assignor's Interest
Recorded: 2014-05-01
Pages: 8
Assignors
FALSTER, ROBERT J.
Executed: 2014-04-29
VORONKOV, VLADIMIR V.
Executed: 2014-04-28
PITNEY, JOHN A.
Executed: 2014-04-24
ALBRECHT, PETER D.
Executed: 2014-04-24
Assignee
SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
80 ROBINSON ROAD, #02-00, SINGAPORE, 068898, SINGAPORE
Covered Property
(1)
Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; ALBRECHT, PETER D.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032667/0872 →
Assignment of Assignor's Interest
May 22, 2014
From: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 032947/0117 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →