IP Library Assignment 032947/0117
Patent Assignment
Reel/Frame 032947/0117

Assignment of Assignor's Interest

Recorded: 2014-05-22 Pages: 7
Assignor
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01, STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Properties (12)
Czochralski Crucible for Controlling Oxygen and Related Methods
Patent: 9,863,062 →
Application: 13/804,585 →
Publication: US 2014/0261154
Methods of Controlling Gas Distribution in a Chemical Vapor Deposition System Using Orifice-Containing Plugs
Application: 13/828,863 →
Publication: US 2014/0273503
Gas Distribution Plate for Chemical Vapor Deposition Systems and Methods of Using Same
Patent: 9,328,420 →
Application: 13/828,926 →
Publication: US 2014/0273409
Inject Insert Liner Assemblies for Chemical Vapor Deposition Systems and Methods of Using Same
Patent: 9,117,670 →
Application: 13/829,021 →
Publication: US 2014/0273410
Methods of Using Inject Insert Liner Assemblies in Chemical Vapor Deposition Systems
Application: 13/829,134 →
Publication: US 2014/0273411
Crucible for Controlling Oxygen and Related Methods
Application: 13/837,092 →
Publication: US 2014/0261155
Oxygen Precipitation in Heavily Doped Silicon Wafers Sliced from Ingots Grown by the Czochralski Method
Patent: 9,634,098 →
Application: 13/914,925 →
Publication: US 2014/0361408
Systems and Methods for Interferometric Phase Measurement
Patent: 9,384,540 →
Application: 14/095,624 →
Publication: US 2015/0153166
Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension
Patent: 9,583,363 →
Application: 14/142,553 →
Publication: US 2014/0187022
Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Compression
Patent: 9,583,364 →
Application: 14/142,556 →
Publication: US 2014/0187023
Apparatus for Stressing Semiconductor Substrates
Application: 14/142,559 →
Publication: US 2014/0182788
Semiconductor-On-Insulator Wafer Manufacturing Method for Reducing Light Point Defects and Surface Roughness
Patent: 9,202,711 →
Application: 14/209,083 →
Publication: US 2014/0273405
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; ALBRECHT, PETER D.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032667/0872 →
Assignment of Assignor's Interest Apr 16, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; ALBRECHT, PETER D.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032682/0382 →
Assignment of Assignor's Interest Apr 16, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; ALBRECHT, PETER D.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 032682/0322 →
Assignment of Assignor's Interest Apr 29, 2014
From: KIMBEL, STEVEN L.; FERGUSON, STEVEN J.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032779/0654 →
Assignment of Assignor's Interest Apr 29, 2014
From: ORSCHEL, BENNO
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032780/0708 →
Assignment of Assignor's Interest Apr 29, 2014
From: PITNEY, JOHN A.; HAMANO, MANABU
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032780/0556 →
Assignment of Assignor's Interest Apr 29, 2014
From: LIU, QINGMIN; LIBBERT, JEFFREY L.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032778/0879 →
Assignment of Assignor's Interest Apr 29, 2014
From: PITNEY, JOHN A.; HAMANO, MANABU
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032779/0924 →
Assignment of Assignor's Interest Apr 30, 2014
From: ABEDIJABERI, ARASH; PITNEY, JOHN A.; HAMANO, MANABU
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032786/0144 →
Assignment of Assignor's Interest May 1, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; PITNEY, JOHN A.; ALBRECHT, PETER D.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032798/0416 →
Assignment of Assignor's Interest May 1, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; PITNEY, JOHN A.; ALBRECHT, PETER D.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032797/0876 →
Assignment of Assignor's Interest May 1, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032797/0730 →
Assignment of Assignor's Interest May 1, 2014
From: SWAMINATHAN, TIRUMANI N.; ZEPEDA, SALVADOR; HILKER, JOHN DAVID
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032797/0607 →
Assignment of Assignor's Interest May 1, 2014
From: FALSTER, ROBERT J.; VORONKOV, VLADIMIR V.; PITNEY, JOHN A.; ALBRECHT, PETER D.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032798/0129 →
Assignment of Assignor's Interest May 2, 2014
From: ABEDIJABERI, ARASH; PITNEY, JOHN A.; THOMAS, SHAWN G.
To: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
Reel/Frame 032810/0230 →
Assignment of Assignor's Interest Jul 28, 2015
From: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
To: SUNEDISON, INC
Reel/Frame 036197/0524 →
Assignment of Assignor's Interest Jul 28, 2015
From: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
To: SUNEDISON, INC
Reel/Frame 036197/0473 →
Security Interest Aug 11, 2015
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 036329/0470 →
Security Interest Jan 12, 2016
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 037485/0343 →
Release of Security Interest Jan 13, 2016
From: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
To: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
Reel/Frame 037508/0884 →
Security Interest Jan 13, 2016
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, SOLELY IN ITS CAPACITY AS COLLATERAL TRUSTEE
Reel/Frame 037508/0606 →
Patent Security Agreement Apr 28, 2016
From: SUNEDISON, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS ADMINISTRATIVE AGENT
Reel/Frame 038557/0472 →
Assignment of Assignor's Interest Apr 27, 2017
From: SUNEDISON, INC.; SUNEDISON PRODUCTS SINGAPORE PTE. LTD.; MEMC PASADENA, INC.; SOLAICX
To: CORNER STAR LIMITED
Reel/Frame 042351/0659 →
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →