IP Library › Assignment 032778/0879
Patent Assignment
Reel/Frame 032778/0879

Assignment of Assignor's Interest

Recorded: 2014-04-29 Pages: 5
Assignors
LIU, QINGMIN
Executed: 2014-04-24
LIBBERT, JEFFREY L.
Executed: 2014-04-24
Assignee
SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
80 ROBINSON ROAD, #02-00, SINGAPORE, 068898, SINGAPORE
Covered Property (1)
Semiconductor-On-Insulator Wafer Manufacturing Method for Reducing Light Point Defects and Surface Roughness
Patent: 9,202,711 →
Application: 14/209,083 →
Publication: US 2014/0273405
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 22, 2014
From: SUNEDISON SEMICONDUCTOR PTE. LTD. (UEN201334164H)
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 032947/0117 →
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →