Patent Assignment
Reel/Frame 032832/0317
Assignment of Assignor's Interest
Recorded: 2014-05-06
Pages: 2
Assignors
CAMPION, DAVID
Executed: 2014-04-25
BOYD, JASON
Executed: 2014-04-25
DELEVE, TRAVIS
Executed: 2014-04-25
Assignee
JST MANUFACTURING, INC.
219 E. 50TH ST., BOISE, IDAHO, 83714
Covered Property
(1)
Semiconductor Wafer Chuck and Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 12, 2019
From: STAFFORD, JACOB
To: JST MANUFACTURING, INC.
Reel/Frame 050353/0648 →
Security Interest
Aug 14, 2024
From: JST MANUFACTURING, INC.
To: BANK OF AMERICA, N.A., AS LENDER
Reel/Frame 068286/0117 →
Release of Security Interest
Oct 2, 2025
From: BANK OF AMERICA, N.A.
To: JST MANUFACTURING, INC.
Reel/Frame 072445/0214 →