IP Library › Assignment 050353/0648
Patent Assignment
Reel/Frame 050353/0648

Assignment of Assignor's Interest

Recorded: 2019-09-12 Pages: 2
Assignor
STAFFORD, JACOB
Executed: 2013-04-23
Assignee
JST MANUFACTURING, INC.
219 E. 50TH ST., BOISE, IDAHO, 83714
Covered Property (1)
Semiconductor Wafer Chuck and Method
Patent: 9,349,602 →
Application: 14/261,281 →
Publication: US 2014/0322919
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2014
From: CAMPION, DAVID; BOYD, JASON; DELEVE, TRAVIS
To: JST MANUFACTURING, INC.
Reel/Frame 032832/0317 →
Security Interest Aug 14, 2024
From: JST MANUFACTURING, INC.
To: BANK OF AMERICA, N.A., AS LENDER
Reel/Frame 068286/0117 →
Release of Security Interest Oct 2, 2025
From: BANK OF AMERICA, N.A.
To: JST MANUFACTURING, INC.
Reel/Frame 072445/0214 →