Patent Assignment
Reel/Frame 072445/0214
Release of Security Interest
Recorded: 2025-10-02
Pages: 4
Assignor
BANK OF AMERICA, N.A.
Executed: 2025-10-01
Assignee
JST MANUFACTURING, INC.
4040 E LANARK ST., MERIDIAN, IDAHO, 83642
Covered Property
(1)
Semiconductor Wafer Chuck and Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 6, 2014
From: CAMPION, DAVID; BOYD, JASON; DELEVE, TRAVIS
To: JST MANUFACTURING, INC.
Reel/Frame 032832/0317 →
Assignment of Assignor's Interest
Sep 12, 2019
From: STAFFORD, JACOB
To: JST MANUFACTURING, INC.
Reel/Frame 050353/0648 →
Security Interest
Aug 14, 2024
From: JST MANUFACTURING, INC.
To: BANK OF AMERICA, N.A., AS LENDER
Reel/Frame 068286/0117 →