IP Library › Assignment 032957/0406
Patent Assignment
Reel/Frame 032957/0406

Assignment of Assignor's Interest

Recorded: 2014-05-23 Pages: 3
Assignor
YUGAWA, HIDETOSHI
Executed: 2014-05-14
Assignee
KYOCERA SLC TECHNOLOGIES CORPORATION
656, ICHIMIYAKE, YASU-SHI, SHIGA, 520-2362, JAPAN
Covered Property (1)
Wiring Board and Method of Manufacturing the Same
Patent: 9,237,649 →
Application: 14/285,733 →
Publication: US 2014/0353021
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 13, 2015
From: KYOCERA SLC TECHNOLOGIES CORPORATION
To: KYOCERA CIRCUIT SOLUTIONS, INC.
Reel/Frame 036344/0749 →
Merger Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →