IP Library › Assignment 033256/0360
Patent Assignment
Reel/Frame 033256/0360

Release of Security Interest

Recorded: 2014-06-30 Pages: 6
Assignor
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD-A700, PHOENIX, ARIZONA, 85008
Covered Properties (6)
Voltage and Current Reference Circuit with a Low Temperature Coefficient
Patent: 5,760,639 →
Application: 08/610,022 →
Comparator with Latch
Patent: 5,757,210 →
Application: 08/699,493 →
Power Conversion Integrated Circuit and Method for Programming
Patent: 5,859,768 →
Application: 08/869,297 →
Power Converter Circuit and Method for Controlling
Patent: 6,429,709 →
Application: 09/210,698 →
Switching Regulator for Power Converter with Dual Mode Feedback Input and Method Thereof
Patent: 6,137,696 →
Application: 09/289,807 →
Power Conversion Integrated Circuit and Method for Programming
Patent: 39,933 →
Application: 09/709,893 →
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2014
From: HALL, JEFFERSON W; ALBERKRACK, JADE
To: MOTOROLA, INC.
Reel/Frame 033197/0384 →
Release of Security Interest Jun 30, 2014
From: JPMORGAN CHASE BANK, N.A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033256/0495 →
Assignment of Assignor's Interest Jul 2, 2014
From: MOTOROLA, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033266/0274 →
Assignment of Assignor's Interest Jul 2, 2014
From: HALL, JEFFERSON W; ALBERKRACK, JADE H
To: MOTOROLA, INC.
Reel/Frame 033229/0444 →
Assignment of Assignor's Interest Sep 24, 2014
From: SEMICONDUCTOR COMPONENTS INDUSTRIES OF RHODE ISLAND, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033809/0027 →
Security Interest Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Release of Security Interest May 6, 2016
From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038632/0074 →
Release of Security Interest May 6, 2016
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038631/0345 →
Corrective Assignment to Correct the Include Schedule a Previously Recorded at Reel: 033266 Frame: 0274. Assignor(S) Hereby Confirms the Assignment. Aug 2, 2016
From: MOTOROLA, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 039363/0698 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest. Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Partial Release of Security Interest in Patents Recorded at Reel 038620 Frame 0087 REEL040075 Frame 0644 Reel 046410 Frame 0933 Reel 046530 Frame 0460 Sep 18, 2018
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 047103/0575 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →