Patent Assignment
Reel/Frame 038631/0345
Release of Security Interest
Recorded: 2016-05-06
Received: 2016-05-06
Pages: 74
Assignor
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Executed: 2010-05-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, AZ, 85008, UNITED STATES
Covered Properties
(100)
Method of Forming a Power Supply Controller and System Therefor
Application:
13/388,183 →
Method for Providing Over Current Protection and Circuit
Application:
13/264,154 →
A method and circuit for suppressing bias current and reducing power loss
Application:
13/264,153 →
Method of and Circuit for Brown-Out Detection
Application:
13/264,150 →
Circuit for Generating a Clock Signal for Interleaved Pfc Stages and Method Thereof
Application:
13/263,319 →
Stitching Methods Using Multiple Microlithographic Expose Tools
Application:
13/196,197 →
Charge Pump Controller and Method Therefor
Application:
11/815,843 →
Transistor and Method Thereof
Application:
12/651,118 →
Power Supply Converter and Method
Application:
12/641,173 →
Power Factor Converter and Method
Application:
12/639,580 →
Method of Forming an Insulated Gate Field Effect Transistor Device Having a Shield Electrode Structure
Application:
12/633,947 →
Circuit and Method for Determining a Current
Application:
12/632,600 →
Vertical Mos Transistor and Method Therefor
Application:
12/630,621 →
Method of Forming a High Capacitance Diode and Structure Therefor
Application:
12/630,670 →
Capacitor Test Method and Circuit Therefor
Application:
12/621,951 →
Semiconductor Package and Method Therefor
Application:
12/616,453 →
Power Supply Controller and Method
Application:
12/614,532 →
Circuit Having Sample and Hold Feedback Control and Method
Application:
12/579,014 →
Method of Forming a Low Capacitance Semiconductor Device and Structure Therefor
Application:
12/574,934 →
Ground Fault Circuit Interrupter and Method
Application:
12/572,870 →
High Voltage Sensor Device and Method Therefor
Application:
12/570,300 →
Alignment of Trench for Mos
Application:
12/560,025 →
Method for Detecting a Current and Compensating for an Offset Voltage and Circuit
Application:
12/557,206 →
Method of Forming a Molded Array Package Device Having an Exposed Tab and Structure
Application:
12/553,706 →
Semiconductor Component and Method of Manufacture
Application:
12/549,100 →
Transistor Diagnostic Circuit
Application:
12/548,293 →
Method of Forming a Leaded Molded Array Package
Application:
12/535,475 →
Edge Seal for a Semiconductor Device and Method Therefor
Application:
12/499,241 →
Edge Seal for a Semiconductor Device
Application:
12/499,429 →
Process of Forming an Electronic Device Including an Integrated Circuit with Transistors Coupled to Each Other
Application:
12/495,250 →
Process of Forming an Electronic Device Including a Well Region
Application:
12/495,278 →
Method for Starting a Brushless Sensorless Dc Motor
Application:
12/495,329 →
Switching Power Supply Control
Application:
12/479,223 →
Wire Bond and Redistribution Layer Process
Application:
12/476,847 →
Transient Suppression Device and Method Therefor
Application:
12/469,544 →
Monitoring System and Method
Application:
12/463,862 →
Level Shifting Using Cross-Coupled Cascode Transistors
Application:
12/428,285 →
Method for Detecting a Fault Condition
Application:
12/415,009 →
Parasitic Element Compensation Circuit and Method for Compensating for the Parasitic Element
Application:
12/414,862 →
Method of Forming an Eeprom Device and Structure Therefor
Application:
12/414,071 →
Method of Forming a Sensing Circuit and Structure Therefor
Application:
12/413,271 →
Bi-Directional Transistor with by-Pass Path and Method Therefor
Application:
12/408,565 →
Method for Regulating Temperature
Application:
12/397,444 →
Method of Forming Low Capacitance Esd Device and Structure Therefor
Application:
12/395,076 →
Method of Forming a Control Circuit and Device
Application:
12/367,667 →
Method for Manufacturing a Semiconductor Component and Structure Therefor
Application:
12/362,142 →
Method for Manufacturing a Semiconductor Component
Application:
12/359,445 →
Semiconductor Component and Method of Manufacture
Application:
12/359,043 →
Impedance Compensated Electrostatic Discharge Circuit for Protection of High-Speed Interfaces and Method of Using the Same
Application:
12/332,159 →
Power Semiconductor Device Having Improved Performance and Method
Application:
12/236,947 →
Method of Forming an Mos Transistor
Application:
12/236,718 →
Method of Forming an Integrated Semiconductor Device and Structure Therefor
Application:
12/208,537 →
Semiconductor Trench Structure Having a Sealing Plug and Method
Application:
12/206,541 →
Thinned Semiconductor Wafer and Method of Thinning a Semiconductor Wafer
Application:
12/206,043 →
Semiconductor Device Having Vertical Charge-Compensated Structure and Sub-Surface Connecting Layer and Method
Application:
12/206,516 →
Current Limited Voltage Supply
Application:
12/196,983 →
Low Side Driver
Application:
12/188,962 →
Method and Apparatus of Providing 2-Stage Esd Protection for High-Speed Interfaces
Application:
12/180,440 →
Method of Thinning a Semiconductor Wafer Using a Film Frame
Application:
12/172,075 →
Low Clamp Voltage Esd Device and Method Therefor
Application:
12/170,630 →
Method of Forming a Shielded Semiconductor Device and Structure Therefor
Application:
12/170,202 →
Method of Forming a Bi-Directional Diode and Structure Therefor
Application:
12/134,401 →
Semiconductor Device Having Enhanced Performance and Method
Application:
12/131,295 →
Method of Forming an Oscillator Circuit and Structure Therefor
Application:
12/126,122 →
Non-Volatile Memory Integrated Circuit
Application:
12/112,879 →
Method for Manufacturing an Energy Storage Device and Structure Therefor
Application:
12/108,361 →
Encapsulated Chip Scale Package Having Flip-Chip on Lead Frame Structure
Application:
12/107,568 →
Amplifier Circuit and Method Therefor
Application:
12/091,152 →
Non-Volatile Memory with High Reliability
Application:
12/106,777 →
Method for Adjusting Threshold Voltage and Circuit Therefor
Application:
12/098,847 →
Method of Forming a Semiconductor Package and Structure Therefor
Application:
12/098,813 →
Transient Voltage Suppressor and Methods
Application:
12/098,369 →
Method of Forming a Power Supply Controller and Structure Therefor
Application:
12/056,531 →
Amplification Circuit and Method Therefor
Application:
11/817,392 →
Scalable Electrically Eraseable and Programmable Memory
Application:
12/050,491 →
Method of Manufacturing a Semiconductor Component with a Low Cost Leadframe Using a Non-Metallic Base Structure
Application:
12/049,909 →
Method and Apparatus for Frequency Modulating a Periodic Signal of Varying Duty Cycle
Application:
12/074,459 →
Configurable Demodulator and Demodulation Method
Application:
12/028,292 →
Multi-Format All-Digital Modulator and Method
Application:
12/027,692 →
Digital Data Encoding and Decoding Method and System
Application:
12/027,703 →
Thick Metal Interconnect with Metal Pad Caps at Selective Sites and Process for Making the Same
Application:
12/012,121 →
Thick Metal Interconnect with Metal Pad Caps at Selective Sites and Process for Making the Same
Application:
12/012,120 →
Low Pass Filter Incorporating Coupled Inductors to Enhance Stop Band Attenuation
Application:
12/014,725 →
Multi-Phase Power Supply Controller and Method Therefor
Application:
11/970,326 →
Monolithically Integrated Multiplexer-Translator-Demultiplexer Circuit and Method
Application:
11/966,723 →
Method of Forming a Pwm Controller and Structure Therefor
Application:
11/954,546 →
Power Supply Controller and Method Therefor
Application:
11/917,315 →
Pwm Controller Having Drive Control with Input Voltage Sensing and Method Therefor
Application:
11/954,506 →
Method of Forming a Power Supply Controller and Structure Therefor
Application:
11/917,327 →
Regulated Charge Pump and Method Therefor
Application:
11/916,508 →
Method for Reducing Charge Loss in Analog Floating Gate Cell
Application:
11/943,578 →
Method for Manufacturing a Semiconductor Component That Includes a Field Plate
Application:
11/931,606 →
Power Supply Controller and Method Therefor
Application:
11/930,933 →
Digital Potentiometer Including Plural Bulk Impedance Devices
Application:
11/927,989 →
High Voltage Sensor Device
Application:
11/925,017 →
Single Input Dual Output Voltage Power Supply and Method Therefor
Application:
11/912,795 →
High Temperature Range Electrical Circuit Testing
Application:
11/871,716 →
Self-Aligned Transistor
Application:
11/864,327 →
Multi-Channel Esd Device and Method Therefor
Application:
11/859,624 →
Method of Forming Low Capacitance Esd Device and Structure Therefor
Application:
11/859,570 →